Partial transient-liquid-phase bonding of TiC cermet to stainless steel using impulse pressuring with Ti/Cu/Nb interlayer
Journal of Central South University(2018)
摘要
Partial transient liquid phase (PTLP) bonding of TiC cermet to 06Cr19Ni10 stainless steel was carried out. Impulse pressuring was used to reduce the bonding time, and a Ti/Cu/Nb interlayer was employed to alleviate the detrimental effect of interfacial reaction products on the bonding strength. Successful bonding was achieved at 885 °C under a pulsed pressure of 2–10 MPa within durations in the range of 2–8 min, which was notably shortened in comparison with conventional PTLP bonding. Microstructure characterization revealed the σ phase with a limit solubility of Nb, a sequence of Ti—Cu intermetallic phases and solid solutions of Ni and Cu in α + β Ti in the reaction zone. The maximum shear strength of 106.7 MPa was obtained when the joint was bonded for 5 min, indicating that a robust metallurgical bonding was achieved. Upon shear loading, the joints fractured along the Ti—Cu intermetallics interface and spread to the interior of TiC cermet in a brittle cleavage manner.
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关键词
TiC cermet,transient liquid phase,impulse pressuring,mechanical property,fracture
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