High-Frequency Electromagnetic Simulation and Optimization for GaN-HEMT Power Amplifier IC

Vivek Sangwan,Dipesh Kapoor,Cher Ming Tan,Chia Han Lin,Hsien-Chin Chiu

IEEE Transactions on Electromagnetic Compatibility（2019）

引用 17|浏览4

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摘要

Rapid increase in operating frequencies and power density necessitate the importance of examining electromagnetic compatibility/electromagnetic emissions (EMEs) from high-frequency and high-power integrated circuits (ICs). In this paper, a simulation method is demonstrated to study the EME using gallium nitride high electron mobility transistor power amplifier IC chip as a device under test. Simul...

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Integrated circuit modeling,Solid modeling,Layout,Transistors,Semiconductor device modeling,Computational modeling

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