Reduction of Structural Thermal Resistance for Deep Ultraviolet Light-Emitting Diodes Fabricated on AlN Ceramic Substrate via Copper- Filled Thermal Holes

IEEE Transactions on Components, Packaging and Manufacturing Technology(2018)

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Abstract
In this paper, a structure was proposed to promote thermal management of deep ultraviolet light-emitting diodes (DUV-LEDs) by introducing the aluminum nitride (AlN) ceramic substrate fabricated with copper-filled thermal holes (CFTHs). Different numbers of CFTHs (0,2 × 2,3 × 3, and 4 × 4) were formed in AlN ceramic substrates using direct-plated-copper process. The thermal resistance of DUVLEDs wa...
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Key words
Substrates,Aluminum nitride,Thermal resistance,III-V semiconductor materials,Ceramics,Temperature measurement,Light emitting diodes
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