High-Density Wafer-Scale 3-D Silicon-Photonic Integrated Circuits

This paper discusses recent advances on the newly developed high-density three-dimensional photonic integrated circuits (3-D PICs). In particular, we introduce our efforts in design, fabrication, and characterization toward a silicon photonic wafer-scale light detection and ranging (LIDAR) system populated by 3-D PIC unit cells. The 3-D PIC unit cell includes vertical U-shaped photonic couplers cr...