A Thin Silicon Photonic Platform for Telecommunication Wavelengths

2017 European Conference on Optical Communication (ECOC)(2017)

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摘要
In this work, we present a high speed resonant modulator at 1550nm fabricated in the thin (<; 100 nm) silicon device layer in a standard microelectronics SOI CMOS process. Data transmission at 25 Gbps over short distances and 12.5 Gbps over 50 km is demonstrated.
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关键词
standard microelectronics SOI CMOS process,data transmission,thin silicon photonic platform,high speed resonant modulator,thin silicon device layer,telecommunication wavelengths,wavelength 1550.0 nm,Si
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