Modeling and Analysis of TSV Noise Coupling Effects on RF LC-VCO and Shielding Structures in 3D IC

In this paper, we proposed through silicon via (TSV) to active circuit noise coupling model based on 3-dimensional transmission line matrix method and analyzed the noise coupling paths. When a TSV is located near the active circuit, the noise can easily travel through various coupling paths. With the proposed model, the noise coupling coefficient between TSV and the active circuit in a 3D IC can b...