Packaging And Assembly Challenges For 50g Silicon Photonics Interposers

Bradley Snyder,Nivesh Mangal,Guy Lepage,S. Balakrishnan, Xiao Sun,Nicolas Pantano,M. Rakowski,Lieve Bogaerts,Peter De Heyn,Peter Verheyen,Andy Miller,Marianna Pantouvaki,P. Absil,Joris Van Campenhout

2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC)（2018）

Cited 16|Views52

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Abstract

We address the challenges in realizing low-loss, broadband optical interfaces for high-density fiber or polymer waveguides along with through-silicon via interconnects in a 50 GHz silicon photonics interposer platform suitable for 2.5D/3D packaging with advanced CMOS logic.

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Key words

high-density fiber,assembly challenges,low-loss broadband optical interfaces,silicon photonics interposer platform,3D packaging,2.5D packaging,advanced CMOS logic,polymer waveguides,frequency 50.0 GHz,Si

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