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Packaging And Assembly Challenges For 50g Silicon Photonics Interposers

2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC)(2018)

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Abstract
We address the challenges in realizing low-loss, broadband optical interfaces for high-density fiber or polymer waveguides along with through-silicon via interconnects in a 50 GHz silicon photonics interposer platform suitable for 2.5D/3D packaging with advanced CMOS logic.
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Key words
high-density fiber,assembly challenges,low-loss broadband optical interfaces,silicon photonics interposer platform,3D packaging,2.5D packaging,advanced CMOS logic,polymer waveguides,frequency 50.0 GHz,Si
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