A 3D Photonic-Electronic Integrated Transponder Aggregator With $48\times 16$ Heater Control Cells

An electronic integrated circuit (EIC) and a silicon photonic integrated circuit (PIC) are 3D-integrated. The EIC using the complementary metal-oxide-semiconductor (CMOS) part of STMicroelectronics' BCD8sp 0.16 μm technology controls all 768 switches in the PIC individually and monitors them with 84 transimpedance amplifiers. A scalable analog-digital approach with a cell size of 100 × 100 μm2 for...