Design and Characterization of High-Density Ultrasonic Transducer Array
IEEE Sensors Journal(2018)
摘要
This paper is conducted to design, fabricate, and characterize a novel high-density large-scale ultrasonic transducer, which is based on a 64×4 array of 0.753 MHz piezoelectric micromachined ultrasonic transducer (pMUT) with 100 μm size and 120 μm pitch. The fill factor of the array is 69.4%, which is higher than the other arrays in reports. Sol-gel method with layer-by-layer annealing is used to ...
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关键词
Electrodes,Resonant frequency,Silicon,Etching,Ultrasonic imaging,Bonding,Ultrasonic transducers
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