Extraction of SOI thickness deviation based on resonant wavelength analysis for silicon photonics devices

Tsuyoshi Horikawa,Daisuke Shimura,Hiroyuki Takahashi,Jun Ushida,Yohei Sobu,Akemi Shiina,Masatoshi Tokushima,Seok-Hwan Jeong,Keizo Kinoshita,Tohru Mogami

2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)（2017）

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摘要

The following topics are dealt with: silicon-on-insulator; low-power electronics; MOSFET; integrated circuit design; semiconductor device models; three-dimensional integrated circuits; CMOS integrated circuits; elemental semiconductors; silicon; and nanowires.

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关键词

nanowires,silicon,elemental semiconductors,CMOS integrated circuits,three-dimensional integrated circuits,semiconductor device models,integrated circuit design,MOSFET,low-power electronics,silicon-on-insulator,Si

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