Experimental and numerical characterization of thin woven composites used in printed circuit boards for high frequency applications

•The elastic orthotropic behavior of thin woven composites used in PCB is captured.•The out-of-plane elastic moduli and their temperature dependency are assessed.•The internal structure is precisely described and simulation procedure is explained.•Periodic unit cells with a high volume content of fibers are studied.•An inverse method is proposed to find the behavior of the resin in the laminate.