Application of hybrid PCB stackup

with the increasing data rate, signal attenuation over transmission line (TL) on printed circuit board (PCB) has become a bottleneck for long channel high speed signaling. Using lower loss material is one option to deal with the insertion loss (IL) challenge. However, it may bring side effects to other interfaces like DDR. Besides, lower loss material is usually more expensive. Hybrid PCB can possibly help avoid the side effect of impacting non-SerDes designs and also help save PCB cost. In this paper, hybrid PCB benefit is studied, followed by examples.