The crosstalk analysis of package-PCB complex interconnect structure
Electrical Design of Advanced Packaging and Systems Symposium(2017)
摘要
Accompanied with fast development of the highspeed board/package design, for the complex interconnection structure composed of via, solder ball and printing line has become a basic unit, designer are trying to eliminate or minimize all the impedance mismatches along the high-speed signal path. This paper addresses designing for crosstalk by comparing the crosstalk of near end and far end. The crosstalk can be minimized by optimizing a few parameters such as dielectric constant, current direction and spacing. The impacts of theses parameters are investigated with the help of a full-wave electromagnetic simulation. The results clearly show that the small changes in interconnection structure can affect the impedance mismatch significantly meanwhile degrade the signal propagation performance.
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关键词
packaging,complex interconnection structure,near end crosstalk,far end crosstalk
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