System Scaling for Intelligent Ubiquitous Computing
2017 IEEE International Electron Devices Meeting (IEDM)（2017）
Key words
intelligent ubiquitous computing,artificial intelligence,mobile computing,3D CMOS scaling,3D CMOS logic,brain-like augmented intelligence,wafer based system scaling,machine learning,3D stacking,heterogeneous system integration,3D sensors,3D memory,human brain
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