Computer Simulation Of The Reliability Of Wire Bonds And Ribbon Bonds In Power Electronics Modules
2017 23RD INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC)(2017)
Abstract
Aluminium wires are widely used in power electronics modules to connect power semiconductor devices and other parts of the module electrically. Recently, other interconnect techniques have been proposed such as ribbon bond to improve the reliability, performance and reduce costs of power modules. The reliability of ribbon bond technique for an IGBT power module under power cycling is compared with that of conventional wire bond in this study using electro-thermal nonlinear Finite Element Analysis. The results showed that a single ribbon of 2000 mu m x 200 mu m will replace three wire bonds of 400 mu m in diameter to achieve a similar module temperature distribution under same power load. Using the equivalent plastic strain increment per cycle, it is seen that the ribbon bond is more reliable than the wire bonds. The impact of neglecting joule heat in the wire/ribbon bonds during power cycling simulation has also been investigated.
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Key words
wire bonds,power electronics modules,aluminium wires,power semiconductor devices,ribbon bond technique,IGBT power module,electro-thermal nonlinear Finite Element Analysis,power load,power cycling simulation,module temperature distribution,size 2000.0 mum,size 200.0 mum,size 400.0 mum,Al
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