Si micro-cantilever sensor chips for space-resolved stress measurements in physical and plasma-enhanced chemical vapour deposition

•Stress sensor chips for space-resolved measurement of residual film stress.•Applicable to determine the coefficient of thermal expansion.•High resolution (few MPa) and good reproducibility (relative error < 1%).•Film stress measureable for thicknesses from a few nanometers up to several microns.•Applicable in PVD and PECVD systems.