Equation Chapter 1 Section 1 The Numerical Research Of Influence Of Residual Stress On Interface Damage

Li Chen, Min Xiong,Keqin Ding

2ND INTERNATIONAL CONFERENCE ON APPLIED MECHANICS, ELECTRONICS AND MECHATRONICS ENGINEERING (AMEME)(2017)

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摘要
The crack growth was simulated by mixed-mode cohesive interface model. Based on the principle of equivalence of thermal and mechanics, the effects of residual stress on crack growth and interface damage evolution are researched by finite element model. The results demonstrate that residual compressive stress is more likely to cause material interface crack growth and damage. The material interface is more likely to fail when there is residual compressive stress in the material. The residual compressive stress is more likely to cause the interface crack growth when the crack growth length caused by certain residual compressive stress value is seen an important influence parameter.
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关键词
Residual stress, Interface damage, Mixed-mode cohesive interface model, Equivalence of thermal and mechanics, Numerical simulation
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