Failure Analysis On The Solder Points Cracking Of Cbga Package

Zhibin Wang,Xu Wang,Meng Meng, Leihao Zhang

2017 IEEE 24TH INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA)（2017）

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摘要

The solder points cracking of a component with package of ceramic ball grid array (CBGA) type is studied in the paper. The cracking cause is found and the failure mechanism is clarified. The weakness of the package structure design is demonstrated by comparing the experiment results of two kinds of components, which provides guidance for the reliable design and application.

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关键词

ceramic ball grid array,solder point cracking,CBGA package,failure analysis,package structure design,failure mechanism

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