Creep Fracture Analysis And Control Measures Of Aerospace Electronic Products
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)(2017)
摘要
Based on the special analysis of the special requirements of electronic products, the creep damage of typical tin-lead solder is more complicated in the harsh environment, and the life and reliability of aerospace products are more important. In addition, based on the typical creep damage cases of aerospace electronic products, this paper elaborates the creep rupture mechanism of solder joint in aerospace electronic products, and discusses the requirements of the relevant standards of aerospace electronic assembling.
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关键词
tin lead solder,creep,stress relief
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