Evaluation of Fatigue Behavior of Lead-Free Solder Joints in Four-Point Bending Test by Finite-Element Modeling

IEEE Transactions on Components, Packaging and Manufacturing Technology(2017)

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摘要
Fatigue performance of solder joints in four-point bending test is evaluated by finite-element modeling. A simplified modeling technique is implemented in order to focus on the behavior of the critical solder joint. The fatigue life is estimated by taking into account the creep behavior of the solder joints and the utilization of Morrow's fatigue model. Fatigue life curves are generated for room t...
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关键词
Soldering,Fatigue,Load modeling,Reliability,Chip scale packaging,Finite element analysis,Copper
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