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Preparation of the Low Cost SiC Wafer by the Layer Splitting Method and the Wafer Direct Bonding Method

Takamitsu Kawahara,Naoki Hatta,Toyokazu Sakata,Akiyuki Minami,Kuniaki Yagi,Hidetsugu Uchida, Motoki Kobayasi,Hideki Takagi

Journal of The Japan Society for Precision Engineering（2017）

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Key words
Wafer Bonding,SiC Nanowires
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