Highly Reliable and Highly Reflective Ag Metallizing of a Sapphire Surface of an LED Die

Shuji Shioji,Teppei Kunimune,Masafumi Kuramoto,Katsuaki Suganuma

IEEE Transactions on Components, Packaging and Manufacturing Technology（2017）

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摘要

Previously, we reported the introduction of the low-temperature, pressure-less Ag direct bonding method, which has a high bond strength. In spite of this, when Ag was deposited directly on the sapphire surface of a GaN-based light-emitting diode die as a reflective layer, there were still some remaining problems with unreliable adhesion. Hence, this paper focuses on improving adhesion of Ag to sap...

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Light emitting diodes,Surface treatment,Lead,Thermal resistance,Temperature measurement,Adhesives

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