POL-kw Modules for High Power Applications

To take full advantage of silicon carbide (SiC) devices' superior electrical and thermal performance, advanced power module packaging designs and suitable materials are required. In this paper, the development of a new high power density module using the Power Overlay (POL) packaging platform is presented. The wirebond-less packaging platform has shown significantly reduced electrical parasitics, while providing a thin profile to allow double-side cooling and the integration of gate drive circuits. Various characterization tests were conducted on specimens fabricated and assembled by production equipment, including highly accelerated temperature and humidity stressing (HAST) and high temperature/current exposure. The results presented here were used to establish design guidelines for reliable operation of POL-based power modules.