P‐13.4: Creep Analysis of Flexible AMOLED Screen During Static Bending

In daily life, at different temperatures, flexible AMOLED screens are prone to devise damage and adhesive layer peeling during bending. The mainstream way to solve this problem is to simulate the stress of the display layer and the strain of the cover film at the optimal temperature of the flexible screen bending. In this paper, the bending simulation model of the AMOLED screen was established, and the film layers at different temperatures were analyzed. After studying the creep of different coatings, the creep behavior of the cover film at the optimum temperature was analyzed to fit the viscoelastic constitutive parameters. The results show that the slope of the stress‐strain curve of the cover film increases significantly at 20 ℃, and the probability of mesh deformation increases by 8% compared with 60 ℃. In addition, the creep strain of each film layer of the AMOLED module at room temperature was compared. It shows that the creep strain of the OCA layer colloid is larger than that of other film layers and the creep time of the cover present a deep influence on the position of the stress neutral‐layer of the display layer.