Enclosed casting of epoxy resin for rapid fabrication of rigid microfluidic chips

Sensors and Actuators B: Chemical(2017)

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摘要
•Epoxy resin was demonstrated for rapidly fabricating rigid microfluidic devices.•Enclosed casting enabled by PDMS intermediate molds can produce ready-to-use devices.•A series of bonding methods were developed for epoxy resin with most common materials.•Multilayer microvalve, PCR, and high-speed flow cytometry imaging were tested.
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关键词
Epoxy resin,PDMS,Enclosing casting,Chip bonding,Microfluidics
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