Robust automotive products in advanced CMOS nodes

2017 IEEE International Reliability Physics Symposium (IRPS)(2017)

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摘要
In this work, additional elements needed on top of conventional foundry reliability knowledge to enable robust automotive products in compliance with all restrictive norms are introduced. For intrinsic reliability, the main element is the reliability models (a design compatible WLR description). Their usage for design margins definition and their thorough validation at IP level is described. For extrinsics failure, two different screening procedures, Vstress and Burn-In (conventional or wafer-level), are here well documented and in use for volume production to bring the failure rate level down below 1ppm automotive target. Altogether, the global approach developed in STMicroelectronics enable robust automotive products based on controlled and validated procedures.
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关键词
Records-reliability model,product qualification,automotive,extrinsics,screening,yield,failure rate
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