Application Of Thermal Analysis For Study Of Sn-Ag Electrolytic Alloys On To Copper And Titanium Plates
PROCEEDINGS OF THE 2017 IEEE RUSSIA SECTION YOUNG RESEARCHERS IN ELECTRICAL AND ELECTRONIC ENGINEERING CONFERENCE (2017 ELCONRUS)（2017）
Abstract
In this work there have been studied the processes of co-deposition and layer-by-layer electrochemical deposition of tin-silver alloys of the given composition with near-eutectic and peritectic content of components. To predict the thermal stability of electrochemical deposition of binary systems there have been conducted the thermal research in characteristics of the electrolytic alloys obtained by DSC method.
MoreTranslated text
Key words
electrochemical deposition, near-eutectic and peritectic alloys, differential scanning calorimetry (DSC)
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined