Combining the crack compliance method and speckle interferometry data for determination of stress intensity factors and T-stresses
Engineering Fracture Mechanics(2017)
摘要
•Crack modeling by a sequence of narrow notches.•Recording strain-induced interference fringe patterns.•Displacement measurements on crack borders immediately including CMOD and COD.•Determination of the first four coefficients of Williams’ series.•Calculations of SIF and T-stress.•Cracks in actual and residual stress fields.
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关键词
Crack tip displacement fields,CMOD,Stress intensity factor,T-stress,Electronic speckle-pattern interferometry,Residual stress field
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