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An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing Microsystem

Yu-Chen Hu,Yu-Chieh Huang,Po-Tsang Huang,Shang-Lin Wu,Hsiao-Chun Chang,Yu-Tao Yang,Yan-Huei You,Jr-Ming Chen,Yan-Yu Huang,Yen-Han Lin,Jeng-Ren Duann,Tzai-Wen Chiu,Wei Hwang,Ching-Te Chuang,Jin-Chern Chiou,Kuan-Neng Chen

IEEE Transactions on Electron Devices（2017）

引用 17|浏览56
关键词
mu-probes,MEMS,biosensor,neural sensing microsystem,through silicon via (TSV),2.5-D heterogeneous integration
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