High Thermal Stability Of Sic Packaging With Thermosetting Imide-Based Nanocomposite Encapsulating Materials Combined With Sintered Ag Paste Die-Attach
2016 IEEE 16TH INTERNATIONAL CONFERENCE ON NANOTECHNOLOGY (IEEE-NANO)（2016）
Abstract
Heat-resistance of novel encapsulating materials made from thermosetting imide/silsesquioxane nanocomposites are demonstrated in SiC-SBD packages, which are die-attached with a sintered Ag paste. The test specimens are exposed to thermal cycling between -50 degrees C and 250 degrees C and humidity resistance evaluation test at 121 degrees C, 0.19MPa, 95% Rh. The results reveal that the excellent heat and humidity-resistance is brought by the outstanding stability of the thermosetting imide-based nanocomposite encapsulating materials and its remarkable miscibility to sintered Ag die-attach.
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Key words
thermal stability,SiC-SBD packages,thermosetting imide-based nanocomposite,encapsulating materials,sintered Ag paste die-attach,heat resistance,silsesquioxane nanocomposites,thermal cycling,humidity resistance evaluation test,miscibility,temperature -20 degC to 250 degC,temperature 121 degC,pressure 0.19 MPa,SiC,Ag
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