Modeling of trench structures in integrated circuits for fast isolation effectiveness assessment
2016 International Symposium on Electromagnetic Compatibility - EMC EUROPE（2016）
摘要
In this paper, an analytical modeling methodology is proposed for trench structures in integrated circuit substrates. It is based on a modal characterization of the different doping profiles, dealing with trenches as discontinuities transverse to the direction of propagation. Finally, a method for fast isolation effectiveness assessment of a trench integrated in different substrate types is proposed, that includes the effects of mode interaction.
更多查看译文
关键词
analytical modeling methodology,trench structures,integrated circuit substrates,modal characterization,doping profiles,fast isolation effectiveness assessment,mode interaction
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要