Large-scale flexible conductive copper-silver pattern based on direct photo-patterning via volume additive process on demand

In this paper, a two-step method to fabricate a large-scale flexible conductive pattern via direct photo-patterning and “volume additive process on demand” theory was developed. The copper pattern was formed on the surface of the flexible substrate directly by photo-reduction. However, the copper pattern was not conductive due to the discontinuous structure. Fusion growth of particles was achieved via the “volume additive process on demand” to realize the pattern conductivity without sintering. This method is simple, efficient, low-cost and environmentally friendly, especially for heat sensitive substrate to fabricate large-scale conductive pattern. In addition, “volume additive process on demand” theory could be extended to other preparation methods of metal pattern, such as inkjet printing, to meet the new requirement of electronic industry in the future.