The Numerical Investigation Of Influence For Shape-Parameters To The Current Carrying Capacity Of Solder Joints In The Cucga

In this paper, we studied the current carrying capacity of solder joints in the Copper Column Grid Array (CuCGA) by means of finite element method (FEM). The current carrying capacity of solder joints can be reflected by the peak value of the temperature and current density. And the solder fillets were the critical region in the entire CuCGA. Therefore, the paper mainly studied the influence of the shape-parameters for solder joints and wirings to the peak value of the temperature and current density. The results were as follows, the peak value of the current density of solder fillets occurred in the geometric discontinuity region connected the solder fillets and wirings. And the peak value of the temperature of soldering fillets occurred in the geometric discontinuity region connected the solder fillets and the copper columns. With the increase of height for solder columns, the peak value of current density was constant, while the peak value of temperature decreased slightly. With the increase of diameter for solder columns, both the peak value of current density and the temperature decreased. With the increase of climbing height for soldering, the current density in the solder joints decreased. With the increased of minimum width of wiring, both the peak value of temperature and the peak value of current density appeared the trend of decreased.