Efficient Substrate Noise Coupling Verification and Failure Analysis Methodology for Smart Power ICs in Automotive Applications
IEEE Transactions on Power Electronics(2017)
摘要
This paper presents a methodology to analyze the substrate noise coupling and reduce their effects in smart power integrated circuits. This methodology considers the propagation of minority carriers in the substrate. Hence, it models the lateral bipolar junction transistors that are layout dependent and are not modeled in conventional substrate extraction tools. It allows the designer to simulate ...
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关键词
Substrates,Couplings,Integrated circuit modeling,Failure analysis,Layout,Semiconductor process modeling
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