电沉积制备铜基复合镀层的研究进展
Electroplating & Pollution Control（2014）
Abstract
兼具工艺成本低、工艺流程简单和工艺柔性好等优势的电沉积技术,是制备单元/多元金属基复合镀层的工艺方法.以电沉积制备铜-非金属化合物复合镀层和铜-金属微粒复合镀层为主题,选取制备工艺、参数条件优化及性能表征等方面作为切入点,分别进行概述.
MoreTranslated text
Key words
preparing copper,composite coatings
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined