Thermoelectric hotspot cooling using thermally conductive fillers
Applied Thermal Engineering(2023)
摘要
•Highlights new perspective on thermoelectric cooler (TEC) design for hotspot cooling.•Proposes the thermally-conductive filler-embedded TEC (F-TEC) as an example.•Demonstrates F-TEC has 42.5% higher heat-dissipation capability than conventional TEC.•Visualizes temperature gradient applied to thermoelectric legs using an IR camera.•Presents additional considerations for improving the F-TEC.
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关键词
thermoelectric hotspot cooling
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