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声表面波器件压电芯片粘接工艺的可靠性研究

陈台琼,吴燕,唐代华

Electronics Quality（2003）

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Abstract
本文对声表面波(SAW)器件失效模式以及SAW器件粘片失效模式进行了初步分类和探讨.通过对粘片工序几种失效模式的对比试验,总结了一套针对该工序的较为完整的粘片可靠性增长的控制措施.
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piezodielectric chip,bonding technique
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