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Silicon photonics assembly industrialisation

European Microelectronics Packaging Conference(2015)

Cited 23|Views38
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Abstract
In recent years there have been a number of developments in the field of Silicon Photonics especially for use in Datacentres in order to answer the need of increased data-rate and lower power consumption. Progress made by intensive academic and industrial research on basic Silicon Photonics building blocks has paved the way for large scale industrialisation of devices that can be fabricated by reusing the existing CMOS fabs, and recently important steps have also been taken on the industrialisation on 12 " wafers. In this paper we outline the industrialisation of the assembly and test processes required to enable the implementation of Silicon Photonics including the use of 3D face-to-face integration of separate electronics and photonics die.
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Key words
silicon photonics assembly industrialisation,Datacentres,CMOS,wafers,3D face-to-face integration
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