LTPS-TFTs integrated in RDL for High-End FOPLP Application

Hsin-Cheng Lai,Yu-Hua Chung,Chieh-Wei Feng, Cheng-Hung Yu,Wei-Han Chen, Dzu-How Yu, Tzu-Yen Chang, Chien-Hsun Chu,Terry Tai-Jui Wang

2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)（2018）

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摘要

In order to add the value of FOPLP technology, low temperature poly-silicon thin-film transistor (LTPS-TFT) integrated in RDL with panel level technology has been evaluated. LTPS-TFTs need to be protected by the barrier structure in Cu plating process due to the high concentration of Cu ion. The conception of active device in RDL will be realized by using LTPS-TFT for the high-end FOPLP application such as ESD protection.

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关键词

Electrostatic discharges,Thin film transistors,Plating,Chemicals,Packaging,Ions,Copper

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