Adhesion of Bread Dough to Solid Surfaces Under Controlled Heating: Balance Between the Rheological and Interfacial Properties of Dough.

The adhesion of wheat dough affects many aspects of industrial baking, from kneading raw dough to the final baking process. In this work, an original method was developed to study the effect of temperature on the adhesive properties of bread dough in contact with a solid surface during heating. Using this approach, it will be possible to understand the factors that affect adhesion between dough and a baking surface, which will aid in developing methods to prevent dough from sticking. Overall, the dough's adhesion to a hydrophobic surface globally decreased with an increase in temperature from 35 to 97 degrees C, with the exception of the temperature range between 55 and 70 degrees C, in which the energy of adhesion increased slightly. Under these circumstances, the evolution of adhesion was primarily shaped by the rheological properties of the dough. However, when we used a solid surface with different surface energy, the results changed significantly, which suggests that the mechanisms of adhesion during heating are governed by a balance between the interfacial and bulk properties of the heated dough. The overall decrease in the adhesion of the dough to the hydrophobic glass surface may be explained by a decrease in dough hydrophobicity due to structural and chemical changes in the dough.