Cathodoluminescence spectroscopy for failure analysis and process development of GaN-based microelectronic devices
2018 IEEE International Reliability Physics Symposium (IRPS)(2018)
Abstract
This contribution assesses the potential of quantitative cathodoluminescence spectroscopy (CL) to speed up microelectronics development and failure analysis (FA). It does so through a recent example study performed on a High Electron Mobility Transistor substrate stack structure. The technique, performed on an Attolight Allalin
TM
tool, shows capabilities such as defect identification, stack layer recognition. In a second analysis step, the respective contributions of strain and composition variations are determined in AlGaN system, suggesting that at least in this case, composition and temperature trump strain in terms of contribution importance. This leads to the determination within less than 1% of the Al concentration in Al
x
Ga
1-x
N alloys, which is at least as good as TEM EDS techniques, and is 1-2 orders of magnitude faster.
MoreTranslated text
Key words
Quantitative cathodoluminescence spectroscopy,Scanning electron microscopy,High mobility electron transistors,Gallium nitride,Failure analysis
AI Read Science
Must-Reading Tree
Example
![](https://originalfileserver.aminer.cn/sys/aminer/pubs/mrt_preview.jpeg)
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined