Improved interface characteristics of Mo/SiO 2 /4H-SiC metal-oxide-semiconductor with post-metallization annealing

Journal of the Korean Physical Society(2018)

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Abstract
The effects of post-metallization annealing (PMA) have been investigated for thermally-grown SiO 2 on 4H-SiC metal-oxide-semiconductor (MOS) with a molybdenum (Mo) gate electrode. Mo is a great metal gate material for Silicon carbide (SiC) due to its high thermal budget and low thermal expansion coefficient, which allows high-temperature processing after the gate electrode formation. In this study, PMA process was carried out after Mo gate formation on thermally-grown SiO 2 /4H-SiC in the temperature range from 600 to 1000 °C in N 2 or a forming gas ambient. The fabricated Mo/SiO 2 /4H-SiC MOS device annealed at 800 °C exhibited excellent interface characteristics with negligible hysteresis in comparison with as-grown or post-oxidation annealed samples.
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Key words
4H-SiC,High temperature,Post-metallization annealing,MOS interface,Molybdenum
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