Analysis of Electrical and Nano-Mechanical Properties of Cu-Fe Thin Foil Using Dynamic Nanoindentation.

A Cu-Fe thin foil for high-performance leadframe semiconductor packaging was prepared by powder metallurgy and mechanical rolling, and its nano-mechanical and electrical properties were analyzed. The phases in the final Cu-Fe thin foil were Cu (Fm-3m), Fe (Im-3m), and Cu0.8Fe0.2 (Fm-3m). The nano-hardness, stiffness, and fatigue limit values of the Cu-Fe thin foil based on the Oliver and Alekhin models were 2.3 GPa, 158.1 MPa, and 0.17, respectively, while its surface resistivity was 6.953 Omega /sq.