Simulating and analyzing the thermal cycle behaviors of conductive film bonding PV module

Solar Energy(2017)

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Abstract
•Established 2D FEA model of CF PV module based to simulate the trend of stress concentration at interface of cell when temperature repeated during thermal cycle.•Compared stress nephogram of typical position in module with various encapsulant.•EL images and microscope pictures of cross profile were utilized to straightforwardly validate the effectiveness of simulations.
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Key words
Simulation,Thermal cycle (TC),Conductive film (CF),Stress concentrated,Validation
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