High-Density And Low-Leakage Novel Embedded 3d Mim Capacitor On Si Interposer

C. Roda Neve,M. Detalle, P. Nolmans,Yunlong Li,J. De Vos,G. Van Der Plas,G. Beyer,E. Beyne

2016 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC)（2016）

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摘要

In this work we present a novel technique to fabricate embedded 3D MIM capacitor on Si interposer showing capacitance densities as high as 96 nF/mm2 and low leakage current of 1.5 pA/nF, while having a breakdown voltage of 10.5 V and > 10 years lifetime (T50%@1V,100 degrees C = 5.18e16 s).

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关键词

MIM capacitor,Si Interposer,3D MIM

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