On determining optimal parameters for testing devices against laser fault attacks

2016 International Symposium on Integrated Circuits (ISIC)(2016)

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摘要
Laser equipment has been used for a failure analysis for a long time. It is also becoming increasingly popular in fault injection attacks. Since it can be challenging to master this technique and get plausible results from experimental evaluations, in this paper we provide a set of guidelines and best practices that might help researchers to get the basic idea on this topic. First, we describe different decapsulation techniques with details on de-packaging steps. After that, we provide insights on choosing the right laser setup for laser fault injection. Finally, we provide hands-on experience on device profiling for making the attack successful.
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关键词
device profiling,laser fault injection,depackaging steps,decapsulation techniques,fault injection attacks,failure analysis,laser equipment,laser fault attacks
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