TSF3D: MSV-driven Power Optimization for Application-Specific 3D Network-on-Chip
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems（2017）
Abstract
Power consumption has become one of the major challenges in current chip design. One effective low power technology, multiple supply voltages (MSVs), has succeeded in 2D network-on-chip (NoC) design. However, few researches considered the MSV in 3D NoC, especially application-specific 3D NoC. In this paper, a complete three-stage synthesis flow for MSV-driven application-specific 3D NoC is propose...
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Key words
Three-dimensional displays,Optimization,Power demand,Switches,Through-silicon vias,Algorithm design and analysis,Network-on-chip
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