Exploring Time and Energy for Complex Accesses to a Hybrid Memory Cube.

Through-Silicon Vias (TSVs) and three-dimensional die stacking technologies are enabling a combination of DRAM and CMOS die layer within a single stack, leading to stacked memory. Functionality that was previously associated with the microprocessor, e.g. memory controllers, can now be integrated into the memory cube, allowing to packetize the interface for improved performance and reduced energy consumption per bit. Complex memory networks become feasible as the logic layer can include routing functionality. The massive amount of connectivity among the different die layers by the use of TSVs in combination with the packetized interface leads to a substantial improvement of memory access bandwidth. However, leveraging this vast bandwidth increase from an application point of view is not as simple as it seems. In this paper, we point out multiple pitfalls when accessing a stacked memory, namely the Hybrid Memory Cube (HMC) in combination with the publicly available openHMC host controller. HMCs internal architecture still has many similarities with traditional DRAM chips like the page-based access, but it is internally partitioned into multiple vaults. Each vault comprises a memory controller and multiple DRAM banks. Pages are rather small and rely on a closed-page policy. Also, the ratio of read and write operations has an optimum of which the application should be aware. The built-in support for atomic operations sounds like a great opportunity for off-loading, but the impact of contention cannot be neglected. Besides exploring such performance pitfalls, we further start exploring the energy efficiency of memory accesses to stacked memory.