6.9 A 1.1??m 33Mpixel 240fps 3D-stacked CMOS image sensor with 3-stage cyclic-based analog-to-digital converters

2016 IEEE International Solid-State Circuits Conference(2016)

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Abstract
There is an increasing demand for high-reality video systems. The ITU-R has standardized video parameters for ultra-high-definition TV (UHDTV), and the full-specification video signal stated in this international standard is prescribed as having a 7,680 (H) × 4,320 (V) pixel count, 120Hz frame frequency with progressive scanning, 12b tone reproduction, and wide color gamut. A 33Mpixel 120fps CMOS image sensor with a 12b column-parallel analog-to-digital converter (ADC) is reported in [1]. In addition to standard operation, higher sensitivity, smaller pixels, and a higher frame rate of 240fps or more are required for CMOS image sensors. Backside-illuminated stacked CMOS image sensors [2] are effective for simultaneously achieving both high sensitivity for small pixels and high operation speed. However, these stacked structures are still insufficient for high-frame-rate UHDTV image sensors since the pixel wafer and the ASIC wafer are connected by through-silicon vias in the peripheral area.
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Key words
CMOS image sensors,analogue-digital conversion,application specific integrated circuits,high definition television,image colour analysis,three-dimensional integrated circuits,3-stage cyclic-based analog-to-digital converters,3D-stacked CMOS image sensor,ADC,ASIC wafer,UHDTV image sensors,color gamut,frequency 120 Hz,high-reality video systems,pixel wafer,size 1.1 mum,through-silicon vias,tone reproduction,ultra-high-definition TV,video parameters,video signal
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