3D advanced integration technology for heterogeneous systems

Pascal Vivet,Christian Bernard,Fabien Clermidy,Denis Dutoit,Eric Guthmuller,Ivan Miro Panades,G. Pillonnet,Yvain Thonnart,Arnaud Garnier,Didier Lattard,Amandine Jouve,Franck Bana,Thierry Mourier,Séverine Cheramy

2015 International 3D Systems Integration Conference (3DIC)（2015）

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Abstract

3D integration technology is nowadays mature enough, offering today further system integration using heterogeneous technologies, with already many different industrial successes (Imagers, 2.5D Interposers, 3D Memory Cube, etc.). CEA-LETI has been developing for a decade 3D integration, and have pursued research in both directions: developing advanced 3D technology bricks (TSVs, μ-bumps, Hybrid Bonding, etc), and designing advanced 3D circuits as pioneer prototypes. In this paper, a short overview of some recent advanced 3D technology results is presented, including some latest 3D circuit's description.

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Key words

3D,TSV,NoC,Active Interposer

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